This is precision-engineered component ideal for use in sensing, microelectronics, and flexible circuit applications. Designed for high performance and stability, it combines a reinforced PI substrate with finely patterned metal layers to ensure durability, flexibility, and electrical reliability.
 
Key Features:
High-Performance Substrate: Built on a polyimide base with a reinforced 13-micron PI film, offering excellent thermal stability and mechanical strength.
Compact and Precise Design: Measuring 10mm x 10mm, the electrode features finely detailed conductive traces, making it suitable for space-constrained applications.
Fine Line Structure:
Line Width: 100μm
Line Spacing: 50μm
Interdigital Length: 7.7mm
Interdigital Configuration: 15 pairs (30 fingers)
Advanced Metal Layer Stack:
Copper (Cu): 12μm
Nickel (Ni): 3μm
Gold (Au): 1μm
This multi-layer construction provides excellent conductivity, corrosion resistance, and solderability.
Temperature Range: Operates reliably within a temperature range of -50°C to 120°C, suitable for a variety of demanding environments.
 
Applications:
Capacitive and resistive sensing
Microelectromechanical systems (MEMS)
Flexible and wearable electronics
Biomedical signal detection
Environmental and gas sensors
 
Product Reference:
This interdigital electrode represents a precise, reliable solution for researchers and engineers seeking high-performance components on a flexible, durable substrate. Its detailed structure and robust materials make it ideal for integration into modern electronic and sensing systems.